MEMS/CMOS Integration

In a well-established, highly productive cooperation, the Fraunhofer institutes IMS and IPMS are developing a process for integrating actuators on CMOS backplanes. Fraunhofer IMS designs the backplane and provides 200 mm wafers to its sister institute Fraunhofer IPMS. In Dresden, MEMS and MOEMS actuators are integrated into the underlying CMOS substrates. The cooperation has already seen spatial light modulators and micro mirror arrays produced.

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