Laserlight

Based on MEMS wafer processes, Fraunhofer ISIT has developed a silicon chip as an optical bench on which all optical components and the diode laser chips are mounted. A specially designed in-situ laser soldering process with precisely dosed energy input is used to contact the laser diodes. The assembly of the components and the wire bonding can be carried out on individual substrates, panels, and 200 mm wafers.

Silicon provides the necessary stability for an optical bench. A precision assembly machine with in-situ laser soldering and active lens adjustment offers the required infrastructure to realize new optical designs and produce demonstrators, such as a multi-channel laser light source.

Characteristics

• Miniaturized multi-channel laser light source (silicon-based optical bench)
• Modular glass-silicon packaging platform for heterogeneous integration of optical components
• Glass cover provides a hermetic viewing window to the side or top
• Si substrate provides the required stability of an optical bench

Benefits 

• Possibility of heterogeneous integration of optical components through a modular glass-silicon packaging platform
• Hermetic lateral viewing window due to glass cover
• Required stability of an optical bench due to silicon substrate
• Possibility of mounting and wire bonding on single substrates and panels as well as on wafers up to 200 mm in size

Application 

• Stimulus of several atoms
• Manipulation or diverse laser cooling, for example in ion traps or superconducting units