Topics
VR/AR/MR (devices, glasses and head-up-displays)
Voice/emotion/gesture recognition & command
Robotics & interfaces (HMI, BCI)
Smart textiles & wearables
Tactile and haptic sensors
Sensory science, odor sensors
Software: cloud & cognitive computing, AI methodology
| Sensors: Tactile sensors (MEMS or optical), pressure sensors (e.g. magneto-resistive, ultrasonic); bio sensors (glucose mgt., sweat / gas sensors); odor sensors | Audio & Voice Recognition: hardware (MEMS loudspeakers, NED and piezo; microphones; acoustic camera/3D Sound Camera) and software (e.g. Acoustic Analysis) |
| Comformable, Fexible, Stretchable Electronics: R2R, S2S, fibre optics (FBG-Sensors, femtosecondlaser), textile integration (e.g. textile 3D integrated shapes) | Object / Event recognition and distance measurement: positioning technologies and AI |
| VR/AR/MR: inertial Sensors, ML for head motion classifaction, MEMS micromirror arrays/scanner, beamforming/-training, VR holodeck (tracking/localisation), light field technology for real-life images | Video: Hardware (Holographs, display technology, multispectral camera, tunable micro lense, LiDAR/Spad Sensors for 3D Images/TOF, movement control and optical distance/runtime measurement, infrared sensors) and software (video compression, image processing, computer vision) |
| Robotics: dextorous/autonomous in-hand manipulation, resistive sensor principle / miniaturized MEMS pressure sensors, artificial robotic skin, spintronics for spectral noise measurements, hall sensors for angle detection of robot arm; multimodal distance and proximity measurement based on CMUTs, training of robot hand to grasp using AI assisted by cameras |
Photonics (LED, Micro LED, LCD Microdisplays, Laser); energy harvesting technologies and Wireless |
| Emotion/Gesture Recognition: emotion lab, embedded AI (neural networks on microcontroller) | AI based intelligent signal processing (DSKI), AI for sensors (SNKI), advanced data analytics; hardware architectures for AI (e.g. Neuromorphic hardware), sensory science using analytic modeling |
Fraunhofer Group for Microelectronics in cooperation with the Leibniz institutes IHP and FBH