Cleanroom Facilities

7 Cleanrooms, partly with Automotive Certification,

200 mm BiCMOS/CMOS Lines, incl. FEOL and BEOL Module,

Special technologies like HV CMOS and high temperature CMOS (up to 300°C),

Interface to Foundry Companies,

300 mm Material, Process and Equipment screening Line,

200 mm / 300 mm Packaging Lines,

Automated Inline Process Monitoring,

Frontend and Backend Contamination Management and Control,

Single process developments and optimizations like Etching, ALD/ALE, Wet Cleaning, Annealing, Epitaxy (Si, SiGe), Implantation, CMP and many more.

6 Cleanrooms with 200 mm MEMS-Lines and Foundry

Interface to Foundry Companies

Selected Processes on 300 mm Wafer diameter

200 / 300 mm Packaging Lines

Frontend and Backend Contamination Management and Control

Single Process Developments and Optimizations like Etching, ALD/ALE, Wet Cleaning, Piezo Materials and many more

SiC-Prototype-Foundry: Production of Silicon Carbide-devices with wafer sizes from 100 mm to 150 mm at Fraunhofer IISB

InP Foundry: InP-Processing up to 4” at Fraunhofer HHI, and Leibniz FBH and InP-based Photonic-Integrated Circuits at Fraunhofer HHI

GaN-on Si 200 mm at Fraunhofer IAF & ISIT

III-V-Semiconductors: GaAs,  In_xGa_1-xAs,  In_xGa_1-xAs_yP_1-y,  InP,  GaN,  AlGaN,  AlN, AlScN, GaSb and more