Fraunhofer Group for Microelectronics in cooperation with the Leibniz institutes IHP and FBH
Wire bond / grating-coupler variant of the opto-electronic SPeeD-400G modulator chip - Optical coupling with surface gratings on chip by means of IZM laser-cut and μm-adjusted glass particles
- Embedding and coupling of a chip-integrated optical modulator in 0.25 µm SiGe-BiCMOS-ePIC technology (electronic-photonic integrated circuit
- ePIC fabricated by FMD member institute IHP for an optical transmission at line rates of 400 Gb/s with 64-GBd DP-Bipolar-8ASK modulatio
- embedding, electrical and optical coupling is used through grating couplers by IZ
- modulator design by ADVA in the BMBF project SPee
- an edge coupler design is in preparation