Fraunhofer Group for Microelectronics in cooperation with the Leibniz institutes IHP and FBH
Example of a chip package
The Fraunhofer institutes ENAS, IIS/EAS, IPMS, IZM-ASSID, in cooperation with GLOBALFOUNDRIES Dresden Module One LLC & Co. KG. are together developing a Universal Sensor Platform (USeP).
GLOBALFOUNDRIES supplies a 22 nm CMOS circuit. A variety of sensors and actuators from the Fraunhofer institutes are integrated into the packaging. The project is advancing innovative packaging, system design, sensor development, data transfer, simulation and testing. The platform also features novel hardware and IT security solutions.