Press

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. By providing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) will work closely with European partners, to make a significant contribution to the European Union´s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconductor technologies. APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” initiative. The overall funding for APECS amounts to € 730 million over 4.5 years.

CEA-Leti, Fraunhofer, imec and VTT Anchoring Multi-Hub Platform to Realize Designs By EU Companies, Researchers and Chip Developers

Since July 2022 the Research Fab Microelectronics Germany (FMD) and Intel have been collaborating to champion and drive 3D heterogeneous integration R&D in Germany. In a series of technical workshops organized by FMD and Intel Europe Research, experts from FMD, Intel, and German industries have defined the 2030+ research roadmap for 3D heterogeneous integration. Challenges and opportunities have been identified for major application areas such as automotive, industry and high-performance computing establishing the foundation for joint research projects in these critically important areas. This is part of the effort in building a strategic research partnership between FMD and Intel to grow heterogeneous 3D integration capabilities in Germany and in Europe, which is also a key topic of Intel Europe Research engagement in the European R&D ecosystem.

By establishing the Microelectronics Academy, the Research Fab Microelectronics Germany (FMD for its acronym in German) is laying the foundation for modern training programs in the field of micro and nanoelectronics aimed at counteracting the shortage of skilled workers in Germany. In cooperation with educational institutions and industry partners, the academy intends to work out a set of practice-based modules during a one-year design phase and subsequently test them over the next three years. Funding for this project is provided by the Federal Ministry of Education and Research as part of the Federal Government's Framework Programme for Microelectronics.

In order to consolidate and expand the existing microelectronic research and development in Germany regarding quantum and neuromorphic computing, the FMD launched on December 1, 2022, a joint project together with four other Fraunhofer institutes, the Jülich Forschungszentrum and AMO GmbH: The Research Fab Microelectronics Germany — Module Quantum and Neuromorphic Computing (FMD-QNC). The German Federal Ministry of Education and Research is funding the equipment and structural setup required for the project.

Aiming to contribute to the reduction of the digital technologies' footprint via research and development, the Fraunhofer and Leibniz institutes cooperating within the framework of the Research Fab Microelectronics Germany (FMD for its acronym in German) are jointly establishing a cross-location competence center for resource-conscious information and communication technology (Green ICT @ FMD). The project, launched on August 1, 2022, is receiving 34 million euros in funding from the German Federal Ministry of Education and Research under the Green ICT initiative. The latter is in turn part of the German government's Climate Action Programme 2030.

In the recently launched joint project "T-KOS" of the Research Fab Microelectronics Germany (FMD), terahertz technology is now to be developed synergistically for industry in the fields of communication and sensor technology for the first time. Innovative system solutions in both areas can make a significant contribution to the successful implementation of future issues such as digitalization, Industry 4.0 or resource efficiency and thus strengthen Germany as a business location in the long term.

In order to use electronic devices securely and reliably, it is important to know where they were manufactured, how they operate and how they are constructed. Although there are currently a number of technical so-lutions for trusted electronics, there is still no consistent methodology for trustworthiness that adequately covers the entire value chain. This is where the research project “Velektronik”, which started in March 2021, comes in.

50Hertz and two FMD member institutes of the research factory “Forschungsfabrik Mikroelektronik Deutschland (FMD)” join forces to test technologies in the field of Artificial Intelligence (AI) in order to detect fault on overhead lines earlier and therefore fix them more efficiently Their objective is to have algorithms automatically assess the recordings from different inspections. Both partners decided to set up a project named “CoDro” for this purpose.

The joint office of the Research Fab Microelectronics Germany (FMD) and the Fraunhof-er Group for Microelectronics will have a new director as from January 1, 2021: Dr. Stephan Guttowski.