Digitale Events

Die Datenverarbeitung von Sensoranwendungen kann zunehmend direkt in der Edge erfolgen, ist allerdings bei einer hohen Performance mit ebenfalls hohen Kosten verbunden. Im Webinar werden Ansätze diskutiert, wie hoch-performante Elektronik mittels angepasster mikroelektronischer Lösungen bei geringeren Kosten für den Mittelstand entworfen werden kann. Im Fokus stehen dabei Sensoranwendungen und Datenverarbeitung, von der Konzeption,  Machbarkeit und Entwurf über mögliche Chipletaufbauten bis hin zur Integration in vorhandene Infrastruktur.

Webinarsprache: Deutsch

Die Teilnahme ist kostenfrei.

Für viele industrielle KI-Anwendungen ist eine Datenanalyse in der Cloud heute keine Option. Insbesondere beim Erfassen und Analysieren von Schwingungen an Maschinen sind aufgrund hoher Abtastraten bei der Sensordatenerfassung Edge Devices gefragt. Aber welche Hardware bietet für eine konkrete KI-Anwendung die passende Leistung und die niedrigsten Kosten? Im Webinar werden aktuell am Markt verfügbare Edge Devices vorgestellt und ihre Besonderheiten diskutiert. Anhand von Anwendungsbeispielen werden Ansätze für eine systematische Leistungsbewertung erläutert und Möglichkeiten vorgestellt, KI-Modelle auf die Besonderheiten der Hardwarearchitektur abzustimmen und damit den Energie- und Kostenbedarf zu minimieren.

Die Teilnahme ist kostenfrei.

Smarte Vibrationssensoren basieren oft auf Microelektronischen Sensoren (MEMS), die zwar als Bauelement in der Produktion getestet und geprüft werden, in der Praxis jedoch auf einer Leiterplatte aufgelötet, in ein Gehäuse eingebaut und mit zusätzlicher Elektronik und Stromversorgung versehen sind. Das fertige Sensorsystem hat somit mitunter völlig andere Vibrationseigenschaften als das einzelne Sensorelement. Im Webinar wird aufgezeigt, wie 3D-Laservibrometrie eingesetzt wird, um die schwingungstechnischen Eigenschaften des Gesamtsystems zu untersuchen und auf eventuelle Probleme in der mechanischen Ankopplung hinzuweisen. Wir zeigen Ihnen, wie die Entwicklung des Sensorsystems unterstützt und dessen Leistung optimiert werden kann. 

Die Teilnahme ist kostenfrei.

At the virtual booth of EuMW 2020 FMD competences in the field of Microwave and Terahertz are represented by the FMD member Ferdinand-Braun-Institut (FBH). 

European Microwave Week 2020 is an entirely virtual SIX day event, including THREE cutting edge conferences, THREE Forums and ONE exciting trade and technology Exhibition featuring leading players from across the globe. EuMW 2020 provides access to the very latest products, research and initiatives in the microwave sector. It also offers you the opportunity for on-line interaction with those driving the future of microwave technology.

The 23rd European Microwave Week combines:

• Three Major Conferences
• Three Forums
• Associated Workshops
• Tailored Courses and Seminars for industrialists, academics and researchers
• Leading International Trade Show
• Exhibitor Workshops and Seminars will be provided by several top organisations with superior expertise in Microwave, RF, Wireless or Radar

12.01.2021, 13:00-14:00 (CET) Live Demo Session

The Smart Reconfigurable Sensor - A highly configurable and fault tolerant radar based platform for communication and distance measurement – M. Ulbricht

13.01.2021, 12:00-13:00 (CET), Live Demo Session

Impulse Radio Ultra-Wideband – a high-precision, three-dimensional localization system for indoor and outdoor applications – D. Martynenko

14.01.2021, 9:30-12:00 (CET) The 19th IHP BiCMOS Workshop on "High Performance SiGe BiCMOS Technology Platform for leading edge RF and Photonic ICs".

Intrinsic stresses and resulting warpage effects have a major impact on reliability during processing and the use phase of electronic components and assemblies.

For example, soldering of warped components can become impossible due to precision requirements in the assembly process. During a Fan-Out Wafer Level (FOWLP) process, excessive warpage can lead to problems in the RDL application. While embedding brittle components like ceramics, these can crack during temperature load.

The underlying issue of warpage and intrinsic stress cannot be erased due to the nature of different materials with different shrinkage being combined in electronic packages. But warpage can be predicted and controlled based on simulation and characterization.. Thus it does not have to be an issue of mystic surprise.

Fraunhofer IZM provides the full set of experience and methods in order to solve and avoid these issues. The expert session will give a brief introduction to this methodology to characterize, predict and minimize warpage effects.

Speaker:

Dr.-Ing. Olaf Wittler (Chief Scientist @ Fraunhofer IZM)

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Latest trends in system integration and packaging are strongly aiming at heterogeneous, hybrid integration solutions such as co-packaging of electronics and optics and disaggregated system on-chip. In this webinar we will present a glass-based platform suitable for these integration strategies and show how our approach allows for a cost reduction compared to other material platforms (such as Si or SiN) as it is based on low-cost display glass which is available in large panel sizes (of up to 457 x 303 mm²) and commercial manufacturing equipment enabling high scalability.

Speaker:

Oliver Kirsch (Scientific Researcher @ Fraunhofer IZM, Department System Integration & Interconnection Technologies)

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Dieser zweitägige Hands-On-Workshop bietet Theorie und Praxis in Einem. Das vermittelte Wissen wird in intensiv betreuten Übungen anhand konkreter Beispiele erfahrbar gemacht und der praktische Umgang mit Deep Learning Workflows eingeübt. Der thematische Fokus des Workshops liegt im Bereich der Computer Vision. Ausflüge in andere Themenbereiche geben zudem einen Einblick in die Vielfalt der möglichen Anwendungsgebiete. Die Übungen basieren auf Google TensorFlow.

Referenten:

Ines Rieger (M.Sc.) ist wissenschaftliche Mitarbeiterin am Fraunhofer IIS

Dominik Seuß (M.Sc) ist Senior Engineer am Fraunhofer IIS

Andreas Foltyn (M.Sc) ist Research Associate am Fraunhofer IIS

Vom 23. bis 25. Juni hätten wir erstmalig unsere Sensorik-Technologieneuheiten auf der »Sensor + Test«, dem weltweit führenden Forum für Sensorik, Mess- und Prüftechnik, in Nürnberg präsentiert. Wie viele Großveranstaltungen dieses Jahr fiel leider auch diese Messe wegen der Corona Pandemie aus.Trotz der Absage der »Sensor + Test« für das Jahr 2020 bleiben die Neuentwicklungen der FMD relevant. Wir möchten Sie deshalb einladen, sich auf den folgenden Webseiten einen Überblick über die geplanten Themen, Exponate und Systeme zu verschaffen.

Human Machine Interface technology is rocketing in importance since ubiquitous technology is more and more trending in terms of a demand for decoupling of full consciousness from user experience. A prominent example is among hearables, relying on an audio interface while not blocking the visional or tactile senses. Other applications require “silence” for different reasons while still keeping the need for comfortable operating and easy use. Gesture recognition will then play a key role in recognizing user input to various technologies without the necessity of direct contact or precisely aimed or timed (inter)actions. MEMS based ultrasonic transducers enable gesture recognition systems that can be produced at a low unit price for high volumes thus becoming just as available as it went to happen with inertial sensors in the past. Fraunhofer IPMS has developed the NEDMUT technology as an ultrasonic transducer for gesture recognition applications bringing together benefits of the MEMS world with modern technology user needs. Fraunhofer IPMS NEDMUT technology comprises a volume utilizing low footprint approach, ultra-low power electrostatic actuation, lead-free all silicon device, phased array, multichannel as well as combined emitter-receiver on chip capabilities. The webinar will give technical insights into the NEDMUTs including design, processing technology and demo devices performance as wells as an ample view on gesture recognition as application.

Referent:

Dr. Bert Kaiser

In autonomen Fahrzeugen ist der Mensch nur noch Mitfahrer. Das Auto steuert selbständig und erkennt Hindernisse und Gefahren. Damit das Fahrzeug seine Umwelt erkennen kann, ersetzen optische Sensoren das Auge des Fahrers. Ein Forscherteam am Fraunhofer-Institut für Photonische Mikrosysteme IPMS in Dresden entwickelt Mikroscannerspiegel (MEMS-Scanner), die ihre Umgebung zuverlässig und störungsfrei wahrnehmen können und gleichzeitig klein und integrierbar sind. Die Vision eines sicheren autonomen Fahrens rückt damit in greifbare Nähe.

Referent:

Jörg Amelung

Innovative technologies in healthcare have long been integrated into devices that treat acute or chronic diseases, and which affect vital prognoses or alter drastically the quality of life of numerous patients. However, tremendous progress in research fields such as biomedical, biophotonics and biosensing now offer completely new approaches that will radically change the way diseases are diagnosed, treated and followed-up. Healthcare systems face a huge challenge in providing the same level of care in an appropriate, efficient and cost-effective way. Digitization of healthcare is an answer to those challenges and Smart Systems will significantly contribute. Innovative solutions for diagnosis and therapy like automated sampling and biopsies, multimodal imaging modalities, automated monitoring of patients vital functions are prominent example. The same underlying technologies can be used for advanced point-of-care diagnostics, enabling the way to a personalized medicine. This webinar will give examples of Smart Systems in Medical and Health and will feature requirements and challenges in this context.

Referent:

• Dr. Michael Scholles (Head of Project Hub “Microelectronic and Optical Systems for Biomedicine”)

Fraunhofer IPMS is bringing the concept of CMUT to the market. This time we are presenting the principle, benefits and applications of this technology in a webinar. Marcel Krenkel from our business area Ultrasonic Components is talking about the in-house success story and the development process of CMUT devices from consulting and modeling up to the manufacturing and characterization. Further applications and currently ongoing research activities will be shown to illustrate the upcoming trends and improvement of current MEMS based ultrasound devices.

Referent:

• Marcel Krenkel

This Webinar discusses application fields and research topics of the FeFET memory technology. The first part gives an insight into the switching mechanism and specialities of HfO2 – based ferroelectric memories. After that, results based on Fraunhofer IPMS research platform for FeFET memories are discussed. Finally potential integration options of FeFET memories will be proposed.

Referent:

• Konrad Seidel

The Fraunhofer Institute for Photonic Microsystems IPMS in Dresden (Germany) is your access to know-how, expertise and modern R&D infrastructure in the field of optical sensors and actuators, integrated circuits, microsystems (MEMS/MOEMS) and nanoelectronics.

Referent:

• Dr. Jan Grahmann

The Fraunhofer Institute for Photonic Microsystems IPMS in Dresden (Germany) is your access to know-how, expertise and modern R&D infrastructure in the field of optical sensors and actuators, integrated circuits, microsystems (MEMS/MOEMS) and nanoelectronics.

This time Dr. Michael Wagner from our business area Spatial Light Modulators is talking about Micro Mirror Arrays and the technological possibilities of spatial light modulation.

Referent:

• Dr. Michael Wagner

Micropumps are increasingly entering wide areas of medical technology. For example, for the production of biopharmaceutical proteins, protein engineering, drug screening, and lab-on-a-chip systems. Micropumps are also a key component for point-of-care diagnostics and drug dosing. Compared to conventional pumps, micropumps have a much smaller dimension. At the same time, new drive solutions are needed to achieve the required pumping performance with small sizes and low energy consumption.

Referentin:

• Dr. Christine Ruffert

Li-Fi (Light Fidelity) technology wirelessly transmits data by means of light. The principle is simple. A transmitter modulator switches a light-emitting diode (LED) on and off so quickly, that it is undetectable by the human eye. Join our webinar series now for a deeper insight!

Referentin:

• Monika Beck